The Defense Advanced Research Projects Agency didn't necessarily specify the famous 5-second timeline, but military leaders wants to develop semiconductors and computer chips that will turn to dust via a remote signal or at a specific time.Called the Vanishing Programmable Resources, DARPA announced a year ago and scheme called Vanishing Programmable Resources, which is dedicated to making expensive stuff disappear.
IBM have now been handed £3.4m to design chips that can be remotely reduced to silicon dust.
This will be achieved by using a fuse to shatter a thin piece of glass substrate which forms the base of the chip. When it goes pop, the glass will hopefully destroy the silicon complementary metal–oxide–semiconductor (CMOS) chip on top of it.
The government tender said:
"IBM plans to utilize the property of strained glass substrates to shatter as the driving force to reduce attached CMOS chips into Si and SiO2 powder. A trigger, such as a fuse or a reactive metal layer will be used to initiate shattering, in at least one location, on the glass substrate.
An external RF signal will be required for this process to be initiated. IBM will explore various schemes to enhance glass shattering and techniques to transfer this into the attached Si CMOS devices."
Alicia Jackson, DARPA program manager said “The commercial off-the-shelf electronics made for everyday purchases are durable and last nearly forever.”
DARPA is looking for a way to make electronics that last precisely as long as they are needed.
The breakdown of such devices could be triggered by a signal sent from command or any number of possible environmental conditions, such as temperature
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